A system on a chip (SoC) is an integrated circuit (IC) that combines all of a system’s essential components onto a single piece of silicon, eliminating the need for separate, bulky system parts. This integration simplifies circuit board design and delivers improved power efficiency and speed without compromising functionality.
Components contained within an SoC can include:
In electronics, the priority is always “more performance, less power, and less space.” This is especially critical for portable devices such as tablets and smartphones, where advanced technology must fit within the smallest possible footprint and consume minimal power. By consolidating all necessary elements into a single package, SoCs enable engineers to create devices that are both fast and compact.
Compact SoCs have become indispensable solutions across various markets, ranging from wired applications like data centers, artificial intelligence (AI), and high-performance computing (HPC) to battery-operated devices such as mobile phones and wearables.
As the name implies, system-on-chip contains nearly all the necessary functional circuit blocks for a full system on a single chip. Generally, you will find the following components on any SoC:
Generally, engineers want to reduce energy waste, save on spending, and further miniaturize devices. With system-on-chip technology, this is possible through advanced integration methods on a single IC.
These compact and versatile chips have powered the rise of smartphones, allowing for incredible power in a small form factor. Similarly, due to their compact and power-efficient qualities, manufacturers are incorporating SoCs into new IoT devices, embedded systems, and even automobiles.
Furthermore, we’ve also seen a shift in SoC technology used in personal computers and laptops to further reduce power consumption and improve performance. Less circuit real estate generally results in less heat generation, less power consumption, and a lower cost of production. This has allowed more efficient device design for heat distribution, minimal latency, and accelerated data transmission.
Because SoCs are highly specialized, they are often applied in individualized tasks. Custom SoCs are now being developed for specific applications such as enhancing machine learning, advanced AI capabilities, and high-performance cloud computing with faster data processing. SoCs can perform multiple calculations as a distributed operation (rather than the limited parallelism offered by traditional CPUs) to further accelerate calculations. For this reason, many companies are now investing in their own development of custom SoCs to support their advanced data and signal processing needs.
With smaller devices so common in our everyday lives, it’s hard to imagine a time when SoCs weren’t in everything. But it wasn’t until the 1970s that the concept of fitting an entire system onto a single microchip first became a reality.
Thanks to their ability to be customized for highly specialized requirements, SoCs can be used in a variety of applications, from children’s toys and doorbell cameras to industrial engines. Some SoC uses include:
The integration of multiple components onto a single chip offers numerous benefits. But when determining if an SoC is the right solution for a device, these benefits must be weighed against the challenges of such a complex design.
Similar to an integrated circuit, the design workflow for a system on a chip involves several stages to plan, refine, and produce. Each stage requires the collaboration of experts including system architects, design engineers, and manufacturers. The major milestones of the SoC design flow include:
The demand for smarter, faster electronics in increasingly challenging spaces will continue to drive the need for SoC innovation. As SoCs are becoming more complex to meet market demands, design engineers should follow a formalized approach to designing and validating these chips. Simulation is an important key to creating a successful SoC design that meets the required design and manufacturing specifications. The power delivery network is getting more complex, and low-power concerns shrink the supply voltage. As a result, signing off the design for signal integrity and power integrity is critical.