Diamond Supporter's Presentation

Driving Innovation in Test & SLM: Real-World Success Stories from Synopsys Partners

Discover how industry leaders like IBM, MediaTek, Google, and Amazon are driving innovation and achieving success with Synopsys solutions. In these exclusive event highlights, you’ll learn how top technology partners:

  • Achieve high-speed access and efficient testing
  • Reduce test costs and streamline workflows
  • Enable in-field test and debug
  • Integrate DFT early in the design process
  • Gain end-to-end yield visibility

Get actionable insights and real-world examples from experts who are transforming semiconductor test and quality. Don’t miss your chance to learn from the best and see how Synopsys technologies are making a difference.

Watch Event Highlights

Synopsys Sessions & Posters

Sessions & Presenters

Session 3A: Tutorial T7 - 3DIC Advanced Packaging, Test & SLM

TTEP Tutorial by Sandeep Goel (TSMC), Yervant Zorian (Synopsys)

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TTEP Tutorial by Sandeep Goel (TSMC), Yervant Zorian (Synopsys)

Session 4A: Tutorial T10 - UCIe based Multi-Chiplets Design & Test

TTEP Tutorial by Debendra Das Sharma (Intel), Yervant Zorian (Synopsys)

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Session 4C: Tutorial T12 - In-Field System Test & Debug

TTEP Tutorial by Amit Pandey (Amazon), Karthik Natarjan (Synopsys), Sankaran Menon (Ericsson)

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Session 6: Opening Ceremony and Award Presentations

Yervant Zorian (Synopsys)

Session 8: Vendor 1 - Diamond Supporter's Presentation: Driving Innovation in Test & SLM: Real-World Success Stories from Synopsys Partners

Kiran Vittal (Synopsys), Google, MediaTek, IBM, Amazon, Marvell

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Session 13C: Special 4 - Advancing Test Interoperability: Inside the IEEE TTSC and Its Roadmap

Saghir A. Shaikh (Intel Corporation), Ric Dokken (Roguevation), Adam Cron (Synopsys), Po-Yao Chuang (Imec), Michael Laisne (Renesas), Parthivi Patil (Medley Networks)

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Session 14: Poster 1 - Improving Deterministic Test Pattern Generation through Massive Static Learning

Peter Wohl (Synopsys), Jonathon Colburn (Synopsys), John Waicukauski (Synopsys), Yasunari Kanzawa (Synopsys)

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Session 14: Poster 1 - Autonomously access 1687 instruments with Controllable ScanRegisters and ScanMuxes at top level with AccessLink

Kshitij Kulshreshtha (Synopsys), Vistrita Tyagi (Synopsys), Shrutika Patil (Synopsys), Manish Arora (Synopsys), Deepika Reddy Yenna (Synopsys), Shamitha Rao (Synopsys)

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Session 17: IEEE TTTC Presentation

Yervant Zorian (Synopsys)

Session 19A: Special 4 - Advances in UCIe-based Multi-die Health

Yervant Zorian (Synopsys), Debendra Das Sharma (Intel), Sandeep Goel (TSMC)

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Session 20: Poster 2 - Test Pattern Aware Streaming Fabric-based Scan Test Methodology

Krishna Gnawali (Synopsys), Andrea Costa (Synopsys), Nathalie Etono (Synopsys), Denis Martin (Synopsys), Amit Purohit (Synopsys)

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Session 21D: Panel Session - How Different Would Silicon Lifecycle Management be in Advanced Nodes

Harish Dixit (Meta), Yervant Zorian (Synopsys), Mehdi Tahoori (IMEC and KIT)

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SLM and 3D TEST/Chiplets Workshops Joint Opening Session

Yervant Zorian (Synopsys), Saman Adham (TSMC) Sreejit Chakravarty (Ampere Computing), Riccardo Cantoro (Polito)

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3D/Chiplets TEST Workshop: Panel Session - EDA/IP Solutions for Test & Repair

Yervant Zorian (Synopsys), Martin Keim (Siemens), Brion Keller (Cadence)

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3D/Chiplets TEST Workshop: Paper - Ring-based DFT Architecture for SOW Stacking Applications

Manish Arora (Synopsys), Sandeep Goel (TSMC)

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SLM and 3D TEST Workshops Joint Paper Session - Leveraging SLM EXTRAM Methodology for HBM4

Arun Kumar (Synopsys), Yervant Zorian (Synopsys)

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SLM Workshop: Panel Session - Automotive Safety & Reliability

Giberto Aguilar (Valens) Davide Appelo (Technoprobe), Mehdi Tahoori (IMEC & KIT), Yervant Zorian (Synposys)