Call for Content

AI & HIGH-PERFORMANCE COMPUTING (HPC)

Explore the forefront of system design and innovation for advanced computing platforms supporting AI and machine learning workloads. Topics encompass next-generation compute architectures, performance optimization, scalable power and thermal management strategies, advanced interconnect and memory technologies, and robust design methodologies for both data center and edge deployments. 

This track also includes 3DIC and multi-die integration, enabling heterogeneous integration of processors, memory, and specialized accelerators to achieve higher bandwidth, density, and energy efficiency—critical for AI and HPC applications. Sessions will highlight Synopsys solutions that accelerate the development, verification, and integration of complex AI/HPC systems, addressing challenges in scalability, reliability, and performance.

FOUNDRY & MANUFACTURING

Delve into manufacturing-centric design practices and collaborative foundry engagement to accelerate silicon success. Topics include TCAD-driven process and device modeling, advanced variability and yield analysis, reliability engineering, and leveraging manufacturing data for design enhancement across leading-edge and established process nodes. Gain insights into how early integration of manufacturing knowledge combined with Synopsys EDA solutions can drive higher quality, reduce risk, and accelerate time-to-market for semiconductor products.

SOFTWARE-DEFINED SYSTEMS

Discover the convergence of hardware and software in the development of intelligent, connected systems. Topics focus on hardware–software co-design for automotive and autonomous platforms, system-level modeling, simulation-based validation (including Ansys tools and solutions), and methodologies to minimize integration risks through early virtual prototyping. Sessions will showcase Synopsys’ comprehensive tools and flows that enable rapid, reliable development of software-defined systems, from concept through deployment.

SILICON PROLIFERATION

Examine the expanding influence of silicon innovation across emerging and diverse application domains. Topics cover vision computing, AR/VR platforms, domain-specific IP, and the integration of compute, sensor, and interface technologies. Emphasis is placed on scalable, reusable silicon building blocks and strategies for overcoming integration challenges. Learn how Synopsys solutions empower designers to accelerate product development, enhance interoperability, and unlock new possibilities in next-generation silicon-enabled systems.