The semiconductor industry’s need for skilled chip designers continues to grow, and hands-on experience is crucial to bridging the gap between academia and industry. To address this, GlobalFoundries (GF) and Synopsys piloted the ‘Chip Design to Tapeout’ education program, offering students at nearly 40 universities worldwide who volunteered for this pilot the opportunity to take their chip designs from concept to silicon.
The pilot trailblazed the Synopsys EDA flow for GF’s 180MCU open source industrial manufacturing technology, which now allows all interested researchers regular silicon proof-of-concept for their ambitioned chip design projects. Synopsys Academic & Research Alliances (SARA) is amplifying this effort by championing academic-industry collaboration and creating pathways for the next generation of chip designers to thrive.
This blog explores how Synopsys Cloud made the ambitious program possible behind the scenes.
The pilot program’s goal was clear: give students a true end-to-end chip design experience, culminating in the physical fabrication of their chips on a standalone 180MCU multi-project wafer (MPW) run provided by GF. However, three significant challenges needed to be overcome in the delivery of the program:
The Synopsys Cloud FlexEDA SaaS environment was chosen by the SARA team as a turnkey solution to overcome these barriers. Unlike a “bring your own compute” (BYOC) model which relies on universities’ existing on-premises infrastructure, the SaaS deployment offered everything needed in one package:
The cloud model made it possible for program leads to quickly deploy and update process design kits (PDKs), training materials, and tools in a single location. Students and teams could access new resources instantly, regardless of geography. The collaborative nature of the environment allowed users to learn from each other, share solutions, and support one another, all within the centralized Synopsys Cloud platform.
Design environment support was managed through direct communication between the program leads and Synopsys Cloud Operations, ensuring rapid response to technical questions, onboarding requests, and data management needs.
The program’s success was not just in the number of students or universities involved, but in the quality of the experience delivered. Students gained hands-on exposure to the full chip design flow, using the same tools, workflows and foundry as commercial chip designers. The centralized, cloud-based approach allowed educators to focus on enabling learning, rather than supporting a distributed design environment with inconsistent tool versions and infrastructure.
Interest in replicating the model for future engagements and in other regions is already growing. To support this growing demand, GF offers 3 shuttles per year to tapeout and receive silicon on its regular GlobalShuttle™ MPW program. Access is available via GF’s Value Added Partners.
As the GF, SARA and Synopsys Cloud teams work together with our industry partners to continue to expand the learning environment, the vision is clear: make advanced chip design education accessible, scalable, and truly industry ready.
The Synopsys and GlobalFoundries ‘Chip Design to Tapeout’ Pilot Program demonstrates how cloud technology can transform semiconductor education. By removing barriers to tool access and compute resources, plus facilitating collaboration across geographically and organizationally distributed learners, Synopsys Academic & Research Alliances with Synopsys Cloud are partnering with educators to empower the next generation of chip designers by turning theory into practice, and ideas into silicon.
For academics interested in workforce development and similar initiatives, please contact Synopsys Academic & Research Alliances (SARA).