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Recognition highlights leadership in agentic AI design, advanced-node enablement, co-packaged optics, and silicon-proven IP for next-generation AI systems
Introduction
As artificial intelligence continues to reshape semiconductor design, success increasingly depends on close ecosystem collaboration across silicon, packaging, IP, and design methodologies. At the 2026 TSMC Open Innovation Platform® (OIP) Ecosystem Forum, Synopsys was honored with five TSMC OIP Partner of the Year Awards, recognizing our collaboration with TSMC to help customers accelerate the development of increasingly complex AI, high-performance computing (HPC), mobile, and advanced semiconductor systems.
The awards span innovations across AI-assisted engineering workflows, advanced-node ecosystem enablement, co-packaged optics design, and silicon-proven interface IP technologies that are helping customers achieve faster design convergence, reduce implementation risk, and bring differentiated products to market sooner.
Celebrating Five Areas of Innovation
1. Joint Development of Design Solutions for COUPE on Substrate
As AI infrastructure scales, the industry is increasingly turning to co-packaged optics (CPO) to overcome the bandwidth and power limitations of traditional electrical interconnects. Synopsys and TSMC were recognized for jointly advancing design methodologies for COUPE on Substrate, enabling integrated electronic-photonic design flows for next-generation co-packaged optical systems.
Through collaboration on TSMC COUPE 4.0 technology, Synopsys has delivered integrated workflows spanning optical, electrical, thermal, and implementation analysis, helping customers accelerate the development and verification of advanced optical interconnect architectures for AI systems.
2. Joint Collaboration on Agentic AI Design Solutions
The growing complexity of semiconductor design makes engineering productivity more important than ever. TSMC recognized Synopsys for advancing agentic AI design solutions that automate analog, digital, and multi-die design workflows.
Built on Synopsys.ai™ technologies and tightly integrated with TSMC process intelligence, these capabilities help designers improve power, performance, and area (PPA), accelerate design convergence, and enhance engineering productivity. The collaboration extends from analog layout automation to digital optimization and emerging multi-die design environments, helping customers tackle increasingly challenging AI system designs.
3. Scaling Ecosystem Advanced-Node Design Expertise
Rapid adoption of advanced process technologies requires not only tools and methodologies but also a highly enabled ecosystem. Synopsys received recognition for its collaboration with TSMC to expand advanced-node expertise through ecosystem enablement, customer training, and design methodology development.
This work complements ongoing collaboration on TSMC’s most advanced technologies, including A14 process enablement, certified AI-powered design flows, multiphysics-aware signoff methodologies, and silicon validation initiatives that help customers confidently adopt next-generation semiconductor technologies.
4. HPC & AI Interface IP
AI systems require unprecedented levels of memory bandwidth, connectivity, and die-to-die communication. Synopsys was recognized for its portfolio of HPC and AI Interface IP, developed in collaboration with TSMC to support next-generation AI and HPC designs.
Recent milestones include enablement and tape-outs for technologies such as PCIe 7.0, HBM4, UCIe, LPDDR6, and 224G Ethernet PHY, delivering the high-performance interconnects and memory subsystems required by modern AI architectures. These silicon-proven solutions help customers reduce risk, achieve first-pass silicon success, and accelerate time to market.
5. Consumer & Mobile Connectivity IP
Synopsys also received a Partner of the Year Award for Consumer & Mobile Connectivity IP, reflecting the breadth of its interface and foundation IP portfolio across mobile, consumer, automotive, networking, and edge AI applications.
With proven IP optimized for TSMC advanced-node technologies, customers can integrate essential connectivity and foundation functions with greater confidence while achieving aggressive power, performance, and scalability objectives.
Innovation Across the AI System Design Continuum
These awards underscore the depth of collaboration between Synopsys and TSMC across the full silicon-to-systems design continuum. From advanced-node implementation and signoff flows to agentic AI-driven automation, multi-die design methodologies, co-packaged optics enablement, and silicon-proven IP, the two companies continue to develop technologies that address the evolving requirements of AI-driven innovation.
Recent joint achievements highlighted at the 2026 TSMC North America Technology Symposium include certified EDA flows on TSMC A14, agentic AI workflow development, integrated voltage regulator (IVR) support for CoWoS®-based multi-die systems, extensions to COUPE 4.0 enablement, and expanded 2nm IP portfolio milestones. Together, these innovations help customers manage growing design complexity while accelerating the deployment of next-generation AI infrastructure.
Driving the Future Together
The pace of AI innovation continues to accelerate, creating new challenges in design productivity, system integration, connectivity, power delivery, and manufacturability. Through ongoing collaboration within the TSMC Open Innovation Platform ecosystem, Synopsys remains committed to delivering the technologies, methodologies, and expertise customers need to bring breakthrough products to market faster.
We are honored by TSMC’s recognition and proud of the teams across Synopsys and TSMC whose collaboration made these achievements possible. We look forward to continuing our partnership as we enable the next generation of AI, HPC, mobile, and intelligent systems innovation.
