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Watch Sessions On‑Demand
Google: Scaling HBM Signal Integrity Signoff for Large‑Scale 2.5D Packages with Parallel Analysis
Google will present how its team addresses large‑scale HBM signal integrity challenges using a scalable signoff methodology.
Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
Discover Intel’s EMIB design techniques using Synopsys tools for efficient, high-speed AI and datacenter system integration. Join our Synopsys Webinar.
Meta: Multi-Die Partitioning and Floorplanning Prior to Netlist Using 3DIC Compiler
Meta will present how an architecture driven methodology, enables early exploration and definition of complex 2.5D and 3D multi die designs.
Intel: From Construction to Signoff: 3DIC Methodology for Disaggregated Designs
Intel shares how disaggregated 3DIC designs drive robust multi‑die construction and signoff across passive and active interposers.
Marvell: Accelerating Interposer Design with Early Signal Integrity Analysis
Learn how Marvell speeds 2.5D/3.5D interposer routing with early SI analysis in Synopsys 3DIC Compiler for faster, safer design.
Intel Presents: Modern EDA Solutions for Scalable Heterogeneous Systems
Discover Intel's modern EDA solutions for scalable heterogeneous systems and their practical use cases. Enhance your designs.
