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Multi-Die Design Start Guide
If you are exploring a multi-die project and need guidelines on getting started, this white paper is for you. Any engineer on a semiconductor design project has read many articles about the power, performance, and area (PPA), functional scalability, and time-to-market advantages of multi-die designs using 2.5D and 3D technologies. The advantages are the main reason the adoption of multi-die design is on the rise. However, the reality is that moving to multi-die design affects many parts of the design process and requires optimized IP, tools, and methodologies to be successful on the initial project.
The white paper:
- Explores the advantages of multi-die design and some of the motivating factors
- Presents guidelines on getting started with key considerations that must be addressed up front on the new project
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