Synopsys at Chiplet Summit

The era of pervasive intelligence is creating new possibilities for innovation and collaboration. Synopsys is driving the new era with a comprehensive and scalable multi-die system solution that accelerates heterogeneous integration. Listen to the Synopsys keynote and various tutorial presentations at Chiplet Summit 2024 to gain expert insights into the technologies you need to move your innovation forward. 

Tutorial A
Tue. February 06, 2024
08:30 - 12:00 PM PST
Multi-Die Systems Test
  • Arun Kumar, Sr. Staff R&D Engineer, Synopsys
Tutorial E
Tue. February 06, 2024
01:00 - 05:00 PM PST
Physical-Aware Architecture Optimization for Multi-Die Systems
  • Holger Keding, Sr. Staff R&D Engineer, Synopsys
Tutorial D
Tue. February 06, 2024
08:30 - 12:00 PM PST
Efficient Monitoring, Test, and Repair of UCIe Links for Multi-Die Systems
  • Yervant Zorian, Fellow, Synopsys
  • Sandeep Goel, Director, TSMC
  • Panelist: Mick Posner, VP of Product Management, Synopsys
Tutorial F
Tue. February 06, 2024
01:00 - 05:00 PM PST
Working with New 3D IC Design Standards
  • Kenneth Larsen, Director of Product Management, Synopsys
Tutorial E
Tue. February 06, 2024
01:00 - 05:00 PM PST
Accelerating I/O Hub and Memory Chiplet Design
  • Manmeet Walia, Product Management Director, Synopsys
  • Erez Shaizaf, Chief Technical Offier, Alchip
Tutorial H
Tue. February 06, 2024
01:00 - 05:00 PM PST
The New Open Chiplet Economy
  • Madhumita Sanyal, Sr. Staff, Technical Product Manager
Keynote
Wed. February 07, 2024
10:50 - 11:20 AM PST
Multi-Die Systems Set the Stage for Innovation
  • Abhijeet Chakraborty, VP Engineering, Synopsys
Track A-101
Wed. February 07, 2024
02:00 - 03:00 PM PST
Developing Secure Multi-Die Systems
  • Dana Neustadter, Director of Product Management, Synopsys
Track B-101
Wed. February 07, 2024
02:00 - 03:00 PM PST
UCIe Reaches a First Step in Interoperability
  • Manuel Mota, Senior Product Manager, Synopsys
  • Stephen Wong, Principal Engineer, Intel
Track B-102
Wed. February 07, 2024
03:15 - 04:15 PM PST
Multi-Die Systems for Aerospace and Defense Applications
  • Kenneth Larsen, Director of Product Management, Synopsys
Panel Track C-103
Wed. February 07, 2024
04:40 - 05:30 PM PDT
Best Way to Optimize Chiplets
  • Mick Posner, VP Product Management, Synopsys

Exhibits

Wednesday, February 7, 2024: 12:00 - 2:00 PM; 5:30 - 7:30 PM

Thursday, February 8, 2024: 12:00 – 2:00 PM

Visit the Synopsys booth #200 to network with our experts and see several multi-die system demonstrations for performance architecture, physical design and analysis, and UCIe & 224G IP solutions.