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Reduce SWaP with Multi-physics Aware 3D Heterogeneous Package Design
Issue #:7 June 2022
Synopsys Solution: Multi-Die System Package Design
Synopsys and Ansys joint solutions that help our aerospace and government customers create systems with lower size, weight and power (SWaP) through 3D heterogeneous integration (3DHI).
Previous Issues
Issue #6: March 2022
Embracing Photonics Applications in Aerospace & Government
Learn about the challenges and benefits of using photonics in A&G systems.
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Issue #5: November 2021
Synplify Synthesis for Microchip RT FPGAs
Synopsys Synplify and verification tools complement Radiation-tolerant Designs with Microchip Radiation-Tolerant FPGAs.
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Issue #4: June 2021
RTL Architect
Aerospace and Defense Engineers Achieve Power, Performance and Area goals for SoC, FPGA and SiP Leveraging RTL Architect.
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Issue #3: March 2021
Software Integrity Products
The Cost of Poor Software Quality in the U.S. and its Implications for Aerospace and Defense
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Issue #2: November 2020
Research & Superconducting Electronics Tool Flow
Synopsys’ Role in the Research and Development of Superconducting Electronics (SCE) and Quantum Computing in Collaboration with IARPA
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Issue #1: July 2020
Security
DARPA’s Automatic Implementation of Secure Silicon (AISS) Program and Synopsys’ Role in Driving the Program to Success
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