<p>Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.</p>

Reduce SWaP with Multi-physics Aware 3D Heterogeneous Package Design
Issue #:7 June 2022

Synopsys Solution: Multi-Die System Package Design

Synopsys and Ansys joint solutions that help our aerospace and government customers create systems with lower size, weight and power (SWaP) through 3D heterogeneous integration (3DHI). 

Previous Issues

Connect with Us