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Hybrid Cloud for Chip Design: Agility, Cost Efficiency, and Data Continuity
Learn how hybrid cloud transforms the design workflow.
White Paper
Made in the Cloud!
Understand the case for IC hardware development in the cloud thanks to high availability, reliability, scalability, performance, and affordability.
Learn More About Synopsys Cloud
EDA on the Cloud
- Realize Up to 5x Faster Timing Signoff with FlexEDA
- Synopsys and GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
- AI Chip Startups Turn to the Cloud to Compete
- Bringing Cloud EDA Tools to a SaaS Model
- 5 Ways FlexEDA with SaaS Model Transforms Chip Design
- EDA in the Cloud: 4 Criteria for Picking the Best EDA Tools
- Why Designers are Using EDA Tools in the Cloud
- How Cloud-Based IC Hardware Design Tools Enhance Chip Design
- Boost Chip Design with AI: How Synopsys DSO.ai on AWS Delivers Lower Power and Faster Time-to-Market
- Synopsys Honored with 2025 Global Technology Innovation Leadership Award from Frost & Sullivan
FlexEDA
- What is FlexEDA? How Does It work?
- 5 Ways FlexEDA with SaaS Model Transforms Chip Design
- Delivering Innovation with the Cloud (AsteraLabs)
- Flexible EDA licensing in AWS with Synopsys Cloud BYOC with FlexEDA
- EDA Productivity and Scalability Uniquely Enhanced with the Cloud
- AI Chip Startups Turn to the Cloud to Compete
- Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud
- Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with Synopsys Cloud
- Mentium Accelerates Tape-out of AI Accelerator Chip for Space Applications on Synopsys Cloud
- TetraMem Delivers RISC-V AI Accelerator Tape-Out in Record Time on Synopsys Cloud
SaaS
- 5 Ways FlexEDA with SaaS Model Transforms Chip Design
- Accelerate RISC-V Verification Using Synopsys Cloud
- AI Chip Startups Turn to the Cloud to Compete
- Bringing Cloud EDA Tools to a SaaS Model
- Cisco Accelerates Project Schedule by 66% Using Synopsys Cloud
- How Cloud-Based IC Hardware Design Tools Enhance Chip Design
- Mentium Accelerates Tape-out of AI Accelerator Chip for Space Applications on Synopsys Cloud
- Pioneering Seamless Interoperability on Cloud Across the Semiconductor Design Ecosystem
- EDA Productivity and Scalability Uniquely Enhanced with the Cloud
- Analog Design on the Cloud
- Target Optimal PPA and Faster Time-to-Market Using Synopsys Cloud Digital SaaS Instance
License Management
Hybrid Cloud
Startups
- AI Chip Design Startup Forum 2025 - Panel Discussion
- DreamBig Semiconductor Boosts Engineering Productivity by 20% to Tapeout AI Accelerator and Network Chiplets with Synopsys 3DIC Compiler on Synopsys Cloud
- Applied Brain Research Tapes Out sub-50mW Processor for Edge Device AI on Synopsys Cloud
- AI Chip Startups Turn to the Cloud to Compete
- AI Startups are Using the Cloud to Accelerate Chip Design and Time-to-Market
- Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with Synopsys Cloud
- Mentium Accelerates Tape-out of AI Accelerator Chip for Space Applications on Synopsys Cloud
- TetraMem Delivers RISC-V AI Accelerator Tape-Out in Record Time on Synopsys Cloud
Customer Success
- Metanoia Success Story
- DreamBig Semiconductor Success Story
- Applied Brain Research Success Story
- M31 Success Story
- Rain AI Succcess Story
- Iontra Success Story
- Cisco Success Story
- HCLTech Success Story
- AsteraLabs Success Story
- TetraMem Success Story
- Achronix Success Story
- Mentium Success Story
- Impare Success Story