Date: Jan 28, 2026
Time: 9:00AM TST | 10:00AM KST/PST
Featured Speakers:
The Synopsys TCAD Seminar is a premier event designed to bring together leading experts, researchers, and engineers from across the semiconductor industry to explore the latest advancements in Technology Computer-Aided Design (TCAD). This seminar serves as a dynamic platform for sharing cutting-edge developments in process and device simulation, design technology co-optimization (DTCO), and AI-accelerated workflows that are shaping the future of semiconductor innovation.
Attendees will gain deep insights into how TCAD enables the design of next-generation devices such as SiC and GaN power electronics, advanced CMOS nodes, quantum technologies, and 3D packaging solutions. With a strong focus on the rapidly growing markets in Asia, the seminar highlights region-specific challenges and opportunities, including the acceleration of EV adoption, energy efficiency demands, and emerging foundry ecosystems.
Through technical presentations and collaborative discussions, participants will discover how Synopsys TCAD solutions—from Sentaurus Process and Device to AI-based calibration and GPU acceleration—empower faster, more accurate R&D cycles and deliver higher ROI.
Whether you are a device engineer, process technologist, or product strategist, the Synopsys TCAD Seminar offers a unique opportunity to connect with industry leaders, explore transformative innovations, and position your organization at the forefront of semiconductor technology.
Time |
Title |
Topics |
10:00 AM – 10:30 AM Japan/Korea (1/28) 09:00 AM – 09:30 AM Taiwan (1/28) |
Industry Trends and TCAD Roadmap by Shela Aboud |
|
10:30 AM – 11:00 AM Japan/Korea (1/28) 09:30 AM – 10:00 AM Taiwan (1/28) |
Presentation by Vanguard International Semiconductor Corporation (VIS) |
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11:00 AM – 11:30 AM Japan/Korea (1/28) 10:00 AM – 10:30 AM Taiwan (1/28) |
The Future of Advanced Logic Scaling by Plamen Asenov |
DTCO, CFET: Reliability/variability |
11:30 AM – 12:00 PM Japan/Korea (1/28) 10:30 AM – 11:00 AM Taiwan (1/28) |
Innovation in Memory: DRAM, Stacking, and Integration by Xi-Wei Lin |
DRAM, Novel Memory: Reliability/variability, Next Gen DRAM-4F2, 3D Stacking, 3DIC/HBM application |
12:00 PM – 12:30 PM Japan/Korea (1/28) 11:00 AM – 11:30 AM Taiwan (1/28) |
A “How-To Guide” to Reduce Calibration Cycle Time by Saurabh Suryavanshi |
Sentaurus Calibration Workbench New Features, SIMs Modules, Success Stories (CTS) |
12:30 PM – 1:00 PM Japan/Korea (1/28) 11:30 AM – 12:00 PM Taiwan (1/28) |
Advances in Power Electronics Devices by Ricardo Borges |
WBG Solutions, Power termination design, Success Story: IGBT |
1:00 PM – 1:30 PM Japan/Korea (1/28) 12:00 PM – 12:30 PM |
New Solutions in TCAD for Manufacturing by Xi-Wei Lin |
S-Topo New Features, CMP, 3DIC |