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What it takes to move data between dies without giving back the advantage.
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Bandwidth between dies
UCIe data rates, memory attach, and reach once compute is split across multiple dies.
Proven ahead of the spec
HBM4 and 3D PCIe validation in real silicon before the standard settles.
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World's First HBM4 IP Test Chip: Early Silicon Validation for Next-Generation AI and HPC
Stacking up, reaching out
Advanced packaging, 3DIO, and the optical path out when the package runs out of room.
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