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Training & Education
Developing AI Multi-Die Designs with Co-Packaged Optics (CPO)
Featured Speakers:
- Sanjay Gangadhara, Senior Program Director for Optics, Synopsys
Presented at EE Times' The Road to Chiplet Scalability 2026, this session explores the electronic-photonic design methodologies required to successfully implement CPO-based architectures. Learn how integrated electronic-photonic design automation (EPDA) flows enable co-design, co-simulation, and multiphysics analysis of photonic and electronic components to accelerate design convergence and reduce implementation risk.
What You'll Learn:
- Key drivers behind CPO adoption for AI and HPC systems
- Challenges in integrating photonic and electronic ICs
- How EPDA flows enable electro-optic co-simulation
- Best practices for chip-package co-design and multiphysics analysis
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Featured Speaker
Sanjay Gangadhara
Senior Program Director for Optics, Synopsys
Sanjay Gangadhara is Senior Program Director for Optics at Synopsys, where he leads strategy for the optics portfolio, including Lumerical, Speos, and Zemax. He drives cross-functional initiatives to deliver advanced simulation solutions, with a focus on co-packaged optics (CPO). With extensive experience across Synopsys, Ansys, and Zemax, he specializes in optical modeling, multiphysics simulation, and photonics system design.
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