Co-Packaged Optics for Multi-Die Designs

As bandwidth scales to 800G and 1.6T, electrical interconnects and pluggable optics reach limits in power, distance, and signal integrity. Co‑packaged optics (CPO) addresses these challenges by moving optical interconnect closer to silicon, reducing electrical path length, lowering power per bit, and enabling higher bandwidth density. This white paper explains why CPO is emerging now, how it is implemented, the key technical challenges, and how Synopsys enables adoption through silicon‑proven interface IP and EDA solutions.

What You’ll Learn

• Why AI data centers are shifting from electrical interconnects to CPO
• How CPO and multi‑die designs improve bandwidth density and power efficiency
• Key CPO design challenges, including thermal management, signal integrity, and multiphysics co‑design
• How photonics ICs (PIC), electrical ICs (EIC), and advanced packaging interact in CPO systems