The Evolution and Requirements of IP for 3D Multi-Die Designs

As Moore’s Law slows and demand for compute and bandwidth accelerates, the industry is rapidly transitioning to 3D multi-die designs. This shift fundamentally changes the requirements for interface IP, which must now operate reliably across complex vertical topologies. This white paper explores the drivers behind 3D multi-die design, including bandwidth density, power efficiency, and heterogeneous integration. 

What you’ll learn:

• Why traditional interface IP falls short in 3D multi-die designs
• Key electrical, physical, and thermal requirements for 3D-enabled IP
• Differences between F2F, F2B, CoW, and WoW topologies
• Verification and test challenges unique to 3D stacking
• How standards-compliant IP enables first-pass silicon success