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SolvNetPlus
Training & Education
The Evolution and Requirements of IP for 3D Multi-Die Designs
As Moore’s Law slows and demand for compute and bandwidth accelerates, the industry is rapidly transitioning to 3D multi-die designs. This shift fundamentally changes the requirements for interface IP, which must now operate reliably across complex vertical topologies. This white paper explores the drivers behind 3D multi-die design, including bandwidth density, power efficiency, and heterogeneous integration.
What you’ll learn:
- Why traditional interface IP falls short in 3D multi-die designs
- Key electrical, physical, and thermal requirements for 3D-enabled IP
- Differences between F2F, F2B, CoW, and WoW topologies
- Verification and test challenges unique to 3D stacking
- How standards-compliant IP enables first-pass silicon success
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