Why is memory design so challenging today?

Modern memory designs must meet demanding power, performance, and area (PPA) requirements, support hyper-convergent architectures, and achieve high reliability and customization across multiple protocols and technologies.

How does Synopsys help accelerate memory design and signoff?

Synopsys provides fast technology pathfinding, DTCO, early process development kit generation, advanced simulation including machine learning, and digitized memory design implementation flows to optimize PPA and speed time-to-market.

What reliability solutions does Synopsys offer for memory?

Synopsys delivers memory-specific electrical rule checking, chip-level electromagnetic/IR analysis, functional safety solutions with ISO 26262 compliance, and silicon lifecycle management tools to address reliability issues early.

How does Synopsys support customization in memory design?

Synopsys enables rapid block or chip-level simulation, machine learning-driven optimization, layout reuse, early parasitic analysis, and provides memory IP for lower integration risk and faster time-to-market.

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几乎所有带开关的电子系统都离不开存储。从物联网到汽车，再到人工智能，这些应用都依赖高带宽、快速吞吐和低延迟的存储。在一个以超融合、深度定制、数字化和严格可靠性要求为特征的时代，开发存储解决方案比以往任何时候都更具挑战。新思科技能够为开发者们提供业内最完整的端到端存储开发方案，帮助您实现设计前移，加快开发周期，提升交付效率。

主要优势

更快实现更优 PPA

快速、精准的技术路径探索、PDK 生成及设计 PPA 评估

打造安全可靠的设计

在整个产品生命周期内实现高性能的安全性与可靠性验证

前移设计，加速定制

更快完成仿真，采用数字化设计实现流程，并缩短签核周期

解决方案

为什么 DTCO 至关重要

提升可靠性

设计左移

为什么 DTCO 至关重要 +

<p>Squeezed by power, performance, and area (PPA) demands, memory designs are moving into a hyper-convergent space, consisting of multiple technologies, protocols, and architectures in one highly complex, increasingly digitized design. To facilitate development of hyper-convergent memory, Synopsys provides fast technology pathfinding, design-technology co-optimization (DTCO), and early design PPA assessments using early process development kit generation flow and integration between TCAD and custom/digital design tools. This is augmented by ultra-fast conventional and machine learning-driven simulation, and “digitized” memory design implementation flows using digital tools spanning timing characterization, digital-on-top verification, and place and route, to enable fast and accurate PPA optimization.</p>

在超融合时代满足 PPA 需求

在功耗、性能和面积（PPA）要求的压力下，存储设计正迈入一个高度复杂、日益数字化的超融合空间，集成多种技术、协议和架构。为了加速超融合存储开发，新思科技提供快速技术路径探索、设计与工艺协同优化（DTCO），以及基于早期工艺开发套件（PDK）生成流程的设计 PPA 评估，并实现 TCAD 与定制/数字设计工具的深度集成。这一流程结合超高速的传统仿真与机器学习驱动的仿真技术，以及数字化的存储设计实现流程，涵盖时序特性分析、数字顶层验证和布局布线，帮助实现快速且精准的 PPA 优化。

为什么 DTCO 至关重要

提升可靠性 +

<p>Exploring new device structures, variants, and process flavors provides a path to better PPA. As technology gaps widen, however, modeling doesn’t capture all the effects on silicon, especially at advanced nodes. To address potential silicon reliability issues early on, Synopsys provides higher coverage with memory-specific electrical rule checking, fast chip-level electromagnetic/IR analysis with power delivery network, functional safety solutions with ISO 26262 compliance, and multi-die system design and silicon lifecycle management tools. </p>

从源头解决可靠性问题

探索新的器件结构、工艺变体和流程创新，是实现更优 PPA 的关键路径。然而，随着技术差距不断扩大，传统建模无法完全捕捉硅片上的所有影响，尤其是在先进节点。为在早期解决潜在的硅片可靠性问题，新思科技提供更高覆盖率的存储专用电气规则检查、快速的芯片级电磁/IR 分析（结合电源网络）、符合 ISO 26262 标准的功能安全解决方案，以及多芯片系统设计和硅生命周期管理工具。

提升可靠性

设计左移 +

<p>With every new memory protocol comes a big step up in performance and runtime. At the same time, the unique needs of different applications are driving increased customization. To scale up swiftly and meet the requirements of new protocols and unique specifications, you need faster design-to-signoff turnaround time. Synopsys can help you shift memory design left by providing faster block or chip-level simulation turnaround times, a machine learning-driven design optimization flow, faster design closure with early parasitic analysis, higher design productivity with layout reuse, and “digitized” memory design implementation flows. You can also lower integration risks and speed time-to-market with our memory IP. </p>

加速高度定制化设计的交付周期

每一种新的存储协议都意味着性能和运行时间的大幅提升，同时，不同应用的独特需求也在推动定制化程度不断提高。要快速扩展并满足新协议和特殊规格的要求，您需要更快的设计到签核周期。新思科技通过提供更快的模块级或芯片级仿真、基于机器学习的设计优化流程、结合早期寄生参数分析的快速设计收敛、更高效的布局复用，以及数字化的存储设计实现流程，帮助您实现设计左移。此外，借助我们的存储 IP，您还可以降低集成风险，加速产品上市。

设计左移