BLOG Apr 28, 2025/1 min read BLOG 3D Multi-Die设计IP By Rob Kruger Tags: Multi-Die System, Synopsys IP Technical Bulletin, Interface IP, Silicon IP
BLOG Feb 14, 2025/1 min read BLOG 到2025年,至少有一半的新型高性能计算芯片设计将采用2.5D或3D Multi-Die技术 By Shekhar Kapoor, Michael Posner Tags: Multi-Die
BLOG Oct 21, 2024/1 min read BLOG 新思科技与世芯科技携手,以Soft Chiplet革命性简化了Multi-Die设计成功路径 By Manmeet Walia, Erez Shaizaf, Manuel Mota Tags: Multi-Die, Silicon IP
BLOG Feb 07, 2024/1 min read BLOG 都是3D封装,飞在天上的芯片和地上的有什么不一样? By Kenneth Larsen, Ian Land, Rob Aitken Tags: Multi-Die
BLOG Dec 26, 2023/1 min read BLOG 从数月到几小时,这枚Multi-Die系统芯片是如何快速交付的? By Filip Thoen, Leonard Drucker, Vivek Prasad Tags: Multi-Die
BLOG Sep 21, 2023/1 min read BLOG 芯片的数字孪生:虚拟原型技术让Multi-Die系统设计轻松实现 By Rikki Lu Tags: Multi-Die System, Chip Design Insights
BLOG Aug 14, 2023/1 min read BLOG 新思科技CEO Aart de Geus:SysMoore时代,Multi-Die系统将重塑半导体未来 By Rikki Lu Tags: Multi-Die, About Synopsys
BLOG Jul 13, 2023/1 min read BLOG 设计更简单,运行更稳健,UCIe标准如何“拿捏”Multi-Die系统? By Rikki Lu Tags: Multi-Die, Design, About Synopsys, Silicon IP, Verification
BLOG Jun 27, 2023/1 min read BLOG 新思科技携手力积电,以3DIC解决方案将AI推向新高 By Rikki Lu Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, Verification
BLOG Jun 16, 2023/1 min read BLOG 晶体管的第一个76年:变小了,却变大了? By Wenjun Ni Tags: Multi-Die, Design, About Synopsys, Verification
BLOG Jun 12, 2023/1 min read BLOG Multi-Die如何引领后摩尔时代的创新? By Wenjun Ni Tags: Multi-Die, About Synopsys
BLOG May 30, 2023/1 min read BLOG 《麻省理工科技评论》:38%的半导体公司将采用Multi-Die系统 By Wenjun Ni Tags: Multi-Die, About Synopsys
BLOG May 24, 2023/1 min read BLOG Multi-Die系统设计里程碑:UCIe PHY IP在台积公司N3E工艺上成功流片 By Wenjun Ni Tags: Multi-Die, Design, About Synopsys, Silicon IP, Verification
BLOG May 12, 2023/1 min read BLOG 为何AI需要新的芯片架构? By Wenjun Ni Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, Verification
BLOG Mar 27, 2023/1 min read BLOG 芯片革命:Multi-Die系统引领电子设计进阶之路 By Wenjun Ni Tags: Multi-Die, About Synopsys, Silicon IP
BLOG Feb 07, 2023/1 min read BLOG 2023是否会成为Multi-Die的腾飞之年? By Guanyi Wang Tags: Multi-Die, Design, About Synopsys, Silicon IP, Verification
BLOG Jan 11, 2023/1 min read BLOG @开发者,2022年这些技术创新,让芯片设计无忧 By Guanyi Wang Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, HPC, Data Center, Silicon IP, Verification
BLOG Nov 02, 2022/1 min read BLOG UCIe生态正在完善,Chiplet腾飞指日可待 By Guanyi Wang Tags: Multi-Die System, Chip Design Insights, Silicon IP
BLOG Oct 05, 2021/1 min read BLOG 何为多裸晶设计——为何越来越受欢迎? By Synopsys Editorial Staff Tags: Multi-Die, Design, About Synopsys, Verification
BLOG Sep 01, 2021/1 min read BLOG 3DIC为后摩尔时代追求更优PPA提供理想平台 By Synopsys Editorial Staff Tags: Multi-Die, Design, About Synopsys, Verification
BLOG Jul 06, 2020/1 min read BLOG 终结单裸片时代? By Synopsys Editorial Staff Tags: Multi-Die, About Synopsys, 5G Wireless, Silicon IP