ARC VPX DSP系列

The post 您的矢量是什么？新思科技推出新型ARC VPX6数字信号处理器 appeared first on Chip Design.

新思科技大胆预测：2025年，Multi-Die技术将被50%新型HPC芯片所采用

The post 到2025年，至少有一半的新型高性能计算芯片设计将采用2.5D或3D Multi-Die技术 appeared first on Chip Design.

新思科技与世芯科技的合作，汇聚了双方数十年来在IP和EDA开发领域的丰富经验和专业知识。新思科技贡献了经验证的完整IP解决方案，包括112G和224G以太网、PCIe 6.0、PCIe 7.0以及UCIe等，同时还提供了业界领先的设计与验证EDA工具

The post 新思科技与世芯科技携手，以Soft Chiplet革命性简化了Multi-Die设计成功路径 appeared first on Chip Design.

The post AI加速技术：Synaptics利用新思科技QIK和DSO.ai“热启动”成功迁移至ARC HS58x3 appeared first on Chip Design.

The post 新思科技登陆中国国际精密光学技术大会：揭秘超透镜设计制造背后的硬核实力！ appeared first on Chip Design.

The post 小芯片互联迈出关键一步！UCIe IP 成功实现跨厂商互操作 appeared first on Chip Design.

The post 迈凯伦都在用的“实用+美学”宝藏级车灯设计方案是什么？ appeared first on Chip Design.

The post 2024冲上热搜的科技爆点：GenAI加入芯片设计与验证 appeared first on Chip Design.

The post 不是系统改版做不起，而是提前架构探索更有性价比 appeared first on Chip Design.

The post 新思科技与三星联手给出5nm移动低功耗芯片一次性流片成功的解题思路 appeared first on Chip Design.

The post 新思科技+英飞凌，携手破解智能汽车密码 appeared first on Chip Design.

The post 都是3D封装，飞在天上的芯片和地上的有什么不一样？ appeared first on Chip Design.

The post 最复杂春运天，把车水马龙龙龙龘龘龘放在“芯”上 appeared first on Chip Design.

The post 从概念到现实：真实感渲染技术让设计效率飙升，告别粗糙原型 appeared first on Chip Design.

The post RISC-V HPC内核从5nm迁移到4nm，1个月还是2天？ appeared first on Chip Design.