Date: Apr 30, 2026 | 9:00 AM PST
As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, stacking multiple dies introduces new multiphysics challenges including electrical, structural, and thermal issues. Join this webinar to learn how RedHawk-SC Electrothermal enables designers to analyze the multiphysics behavior of chips all at once in complex multi-die designs.
Together, Synopsys and Ansys, part of Synopsys, provide engineers a comprehensive flow that offers in-design analysis along with final signoff, enabling faster and more confident development of next-generation multi-die designs.
Attend this webinar to:
Dr. Lang Lin, Product Management, Principal
Bio: Dr. Lang Lin is a technology leader at Synopsys Inc., where he directs product strategy for EDA solutions that ensure the multiphysics integrity, reliability, and security of advanced IC and multi die systems. With a Ph.D. in Electrical and Computer Engineering from the University of Massachusetts, his background spans low power design, multi-die design, and hardware security—areas that continue to influence his work at the intersection of multiphysics modeling and secure silicon design. Dr. Lin has co authored over 40 papers and patents, and his work has been recognized with top honors including IEEE HOST Best Paper Award, IEEE DAC Best Paper Award, and the Ansys CEO Innovation Award. He worked for Intel and Ansys before his product management role at Synopsys.
Profile: Lang Lin | Synopsys