EDA
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SolvNetPlus
Training & Education
Design and Analysis of Multi-Die & 3D-IC Systems
Featured Speaker:
- Jerome Toublanc, Business Development Executive, Synopsys
This Synopsys webinar introduces the audience to the structure of multi-die, 3D-IC systems and explains the various novel multiphysics challenges that they pose for design engineers. The webinar delves into the issues and solutions for:
- Physical integrity
- Power integrity
- Thermal integrity
- Signal integrity
3D-IC assemblies pose some new challenges in each of these areas. Attendees will gain insight into the methodologies and solutions provided by Synopsys to address these challenges based on extensive experience with leading customers that have completed production 3D-IC systems.
Watch On-Demand
Featured Speaker
Jerome Toublanc
Business Development Executive, Synopsys
Jerome has over 20 years of semiconductor industry experience, working for various EDA companies such as Ansys, Avanti, Synopsys, and Apache. He has contributed to the successes of worldwide customers in roles ranging from Application Engineer to Product Management and has covered the chip development flow from RTL to GDSII. He is now a business development executive for Synopsys. His mission is to identify emerging multiphysics Integrity challenges within the semiconductor industry and develop product solutions for the complete chip-package-PCB ecosystem.