Advancing AI-Driven Chip Design: Synopsys and Microsoft Join Forces to Deliver the Future

This session examines how Synopsys and Microsoft are collaborating to bring Agentic AI to chip design. Building on the world’s first agentic AI prototype, showcased at the Design Automation Conference (DAC) in 2025, we will provide an overview of our multi-year collaboration and highlight use cases that demonstrate how agentic AI is accelerating engineering innovation.

With increasing silicon and system level complexity AI-powered solutions offer a promising path to increased productivity, quality, and time to market. Our joint initiative draws on proven methodologies and the latest advances in generative AI, paving the way for autonomous and intelligent design workflows.

The presenters share insights into the evolving landscape of AI, the benefits of agentic workflows, and the potential impact on innovation and time-to-market for the industry

Highlights:

• Synopsys + Microsoft collaboration: Overview of a multi-year joint effort to bring Agentic AI to chip design, building on the first agentic AI prototype 
• Real-world use cases: Examples demonstrating how agentic workflows accelerate engineering innovation amid rising silicon and system-level complexity.
• Industry impact: Insights into the evolving AI landscape and how generative AI–driven autonomous workflows can improve productivity, quality, and time-to-market.