Electrothermal Signoff with RedHawk‑SC

Discover how Synopsys RedHawk‑SC Electrothermal™ delivers a chip‑centric multiphysics platform for 2.5D/3D‑IC prototyping, analysis, and signoff—ensuring thermal, power, signal, and structural integrity across the chip‑package‑system with high‑capacity, foundry‑certified workflows.

Learn how its unified cockpit, hierarchical models, and TSMC 3Dblox support streamline early exploration and layout‑based signoff to accelerate reliable multi‑die design.

Highlights:

• Multiphysics signoff for 2.5D/3D‑IC systems
• Unified thermal & power modeling cockpit
• Foundry‑certified 2.5D/3D‑IC workflows