EDA
System
IP
SolvNetPlus
Training & Education
Addressing Physical Verification for Multi-Die Designs
Multi-die designs using 2.5D and 3D technologies are increasingly important for a wide range of electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile. Multi-die design enables designers to mix dies (also called chiplets) from different foundries and technology nodes, including existing dies from previous projects in a single package.
The resulting density, compute power, and interconnect speeds are much greater than those achievable with traditional monolithic dies. However, multi-die design presents novel issues and challenges that need to be addressed.
This white paper focuses on the physical verification of multi-die designs from one die to multiple dies in a package.
Download Now
Ask
i
NOTICE: You are interacting with an AI-powered chatbot that provides general information about Synopsys, including its products and services, which may be incorrect or incomplete. In the event of any conflict or discrepancy, the terms of your applicable agreements supersede any information provided by this chatbot. These chats may be accessed by Synopsys and its service providers to customize the experience and improve this tool, and your use of this chatbot is an agreement to that data processing activity.