Multiphysics Modeling of HBM for 3D Heterogeneous Integration

Featured Speaker:

• Dr. Lang Lin, Principal Product Manager, Synopsys

3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB, or more, of in-package HBM to handle trillion parameter AI models. Autonomous vehicles may handle smaller individual AI tasks but more of them through multiple levels of sensing and fusion support, computer vision, graphics, safety, security, and communication objectives. Similar requirements are appearing in aerospace and other applications. All require 3D integration with HBM to maximize performance, minimize latency, and minimize power consumption. 

Join this Synopsys webinar to understand the multiphysics challenges facing designers of systems with HBM, including some real customer case studies.