Mastering AI Chip Complexity
Explore challenges and solutions in AI chip development
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Panel: Custom High Bandwidth Memory (HBM) for AI
Date: Mar 19, 2025 | 10:00 AM ACT
Featured Speakers:
- Harry Yoon, Corporate EVP, Products and Solutions Planning , Samsung
- Hoshik Kim, SVP/Fellow, Memory Systems Research , SK Hynix
- Will Chu, SVP & GM, Custom Cloud Solutions Business Unit, Marvell
- Nafea Bshara, VP/Distinguished Engineer, AWS
- John Koeter, SVP, IP Group, Synopsys
- Moderator: Will Townsend, Moor Insights & Strategy
Why You Should Attend:
Leaders from AWS, Marvell, Samsung, SK Hynix, and Synopsys come together for an intriguing discussion on the customization and use of HBM to power AI workloads. The panel delves into the capabilities, challenges, and opportunities of cHBM in multi-die designs.
Some of the topics discussed are:
- cHBM challenges and opportunities
- Implications for DRAM vendors
- Impact of the ecosystem
- Relevance of 3D packaging
- Future of cHBM
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Featured Speakers
Harry Yoon
Corporate EVP, Products and Solutions Planning, Samsung
Harry Yoon is the Corporate Executive Vice President of Samsung Electronics and Head of Americas Products and Solutions Planning, responsible for overseeing silicon product planning and managing strategic collaborations with US customers. With over 20 years at Samsung, he has held various leadership roles, including Vice President of Memory Product Planning & Sales. Harry holds an M.S. in Electronic Engineering from Seoul National University and a B.S. from Yonsei University, Korea.
Hoshik Kim
SVP/Fellow, Memory Systems Research, SK Hynix
Hoshik Kim is the Senior Vice President and Fellow of Memory Systems Research at SK hynix, leading research in memory systems architecture and software solutions for various applications. His current focus is on next-generation memory solutions, including memory disaggregation and near-memory processing for AI and HPC systems. Before joining SK hynix, he worked at Intel Corporation and LG Electronics, gaining extensive experience in architecture, design, and verification for microprocessors and SoCs.
Will Chu
SVP & GM, Custom Cloud Solutions Business Unit, Marvell
Will Chu is the Senior Vice President and General Manager of the Custom Cloud Solutions Business Unit at Marvell, overseeing custom solutions for AI and cloud data centers. Previously, he led the Custom, Compute and Storage Group and the Automotive Business Unit, driving Marvell's semiconductor strategy in the automotive market. With over 20 years of experience, including a role at Maxim Integrated where he significantly grew the automotive business, Will holds a B.S. and M.S. in Electrical Engineering from Tufts University and an MBA from MIT Sloan.
Nafea Bshara
VP/Distinguished Engineer, AWS
Nafea Bshara is the Vice President and Distinguished Engineer at Amazon Web Services and a co-founder of Annapurna Labs, which develops server chips and generates $5 billion in annual revenue. He co-founded Annapurna Labs in 2011 and previously served as VP of Technology at Marvell following its acquisition of Galileo Technologies.
John Koeter
SVP, IP Group, Synopsys
John Koeter leads the IP Group at Synopsys, overseeing the development and support of the company's Intellectual Property (IP) portfolio, including interface, foundation, security, and processor IP. With over 35 years of experience in semiconductor design and IP development, he has held various roles in product management and engineering at Texas Instruments and Advanced Micro Devices. John holds a BSEE degree from Cornell University.
Moderator: Will Townsend
Moor Insights & Strategy
Will Townsend is the Vice President & Principal Analyst at Moor Insights & Strategy. He specializes in areas such as tech, software, enterprise tech, and telecom, with a focus on software development, open source software, and events related to business and tech conferences. Will's insights and analyses are featured in notable publications including Forbes.