EDA
System
IP
SolvNetPlus
Training & Education
Post Silicon Lab Services
Overview of Services
The equipment and technical expertise for post silicon debug and failure analysis, including analysis to detect design intrusion or patent infringement, clone devices, or re-engineering obsolete parts.
- Turn-Key Failure Analysis – Full failure analysis services on qualification failures, yield analysis, or customer returns can be provided by highly trained staff professionals. The service comes with a report completely detailing the analysis steps and results
- FIB (Focused Ion Beam) – Design repair, probe pad deposition and circuit isolation for design support. Our system is capable of mechanical probing of internal nodes to characterize AD/DC analog or digital signals
- Emission Microscopy – Used for transistor level detection of photon emissions (Broad range of 50-nm to 1.2-µm), to localize heat dissipation
- Scanning Acoustic Microscopy (SAM) – Provide non-destructive imagining using ultrasonic waves to detect delamination, voiding, and various features in a sample
- Scanning Electron Microscopy/Energy Dispersive Spectroscopy (SEM/EDS) – Capable of surface analysis with elemental mapping using backscattered or secondary electron imaging
- Real Time X-Ray – Non-destructive inspection of wire-bond, solder bump, PCB, etc. with measurement capability can be performed on the system, with real time video or digital images of X-ray session that can be transmitted to customers on their parts
- Mechanical Probing – Can laser or FIB isolate circuits and electrically characterize circuits with eight mechanical probes to specifications
- Reverse Engineering – Product teardowns, circuit extractions, GDSII layouts, construction analysis
- Sample Preparation – Provide cross-section service of Si, GaAs, InP, and other exotic semiconductors, including polishing “soft” samples that are not possible to cross-section by conventional methods
- Backside Sample Preparation – Thin sample Si, GaAs, and other semiconductors from the backside to 40-µm
- Deprocessing – Layer-by-layer deprocess and documentation to substrate using wet etching and/or dry etching techniques. We have extensive experience with CMP copper technology
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