This paper explains what metal fill is, why it is needed and how the implementation of metal fill has evolved as process technology geometries have shrunk. IC Validator's comprehensive unified fill solution is discussed along with In-Design technology that enables physical verification within the IC Compiler II environment. The paper also discusses the benefits of In-Design track-based metal fill. This new technology is gaining traction to help designers meet today's 20-nm and below metal fill timing performance and DFM requirements.
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