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Golden Signoff Embedded in the RTL-to-GDSII Design Flow with Fusion Compiler
Designing a chip that delivers the best PPA at both ends is one of the biggest challenge designers are facing as the requirements and timing profile are almost opposite. Dr. Henry Sheng, group director of R&D for Synopsys’ Design Group, discusses how Fusion Compiler delivers signoff-accurate PPA on high-performance, low power designs built on advanced technology nodes, and at the same time, accelerates design schedules by eliminating late-stage surprises and unnecessary design iterations.
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