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Keynote: The AI Silicon Puzzle: From Transistors to Trillion-Parameter Systems

Featured Speakers:

Dr. Paul Rousseau, Vice President, Field Technical Solutions Division, TSMC

Why You Should Attend:

Explore how AI is reshaping silicon infrastructure—from compute and memory to advanced packaging and power efficiency. Dr. Paul Rousseau, Vice President, Field Technical Solutions Division of TSMC shares insights on scaling AI to trillion-parameter systems and the need for ecosystem-wide co-design and innovation.

*This presentation was part of SNUG India 2026

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