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Training & Education
Multiphysics Fusion Technology: Solving Power, Thermal, and SI Challenges in Multi-Die Design
Featured Speakers:
- Amlendu Shekhar Choubey, Sr. Director, Product Management, Synopsys
- Dr. Lang Lin, Principal Product Manager, Synopsys
Presented at EE Times' The Road to Chiplet Scalability 2026, this tutorial demonstrates how multiphysics fusion technology enables continuous evaluation of thermal, power integrity (EMIR), and signal integrity effects from early exploration through signoff. Learn how engineering teams can identify issues earlier, make informed design decisions faster, and achieve more predictable multi-die designs.
What You'll Learn:
- How multiphysics analysis fits into the multi-die design flow
- Techniques for evaluating thermal, EMIR, and signal integrity effects
- Methods for correlating analysis results to implementation decisions
- Strategies for achieving reliable, signoff-ready designs
Watch On-Demand
Featured Speakers
Amlendu Shekhar Choubey
Sr. Director, Product Management, Synopsys
Amlendu Shekhar Choubey is the Sr. Director of product management for the 3DIC Compiler platform. He has over 20 years of experience in EDA, semiconductor IP, and advanced packaging, with a strong background in product management, product strategy, and strategic partnerships. Amlendu has expertise in package-board software, including AI-driven design solutions, cloud-based services, and driving growth in emerging markets. Amlendu holds an MBA from UC Berkeley’s Haas School of Business and a B. Tech in Electrical Engineering from IIT Kanpur.
Dr. Lang Lin
Principal Product Manager, Synopsys
Dr. Lang Lin is a technology leader at Synopsys, where he directs product strategy for EDA solutions that ensure the multiphysics integrity, reliability, and security of advanced IC and multi die systems. With a Ph.D. in Electrical and Computer Engineering from the University of Massachusetts, his background spans low power design, multi-die design, and hardware security—areas that continue to influence his work at the intersection of multiphysics modeling and secure silicon design. Dr. Lin has co-authored over 40 papers and patents, and his work has been recognized with top honors including IEEE HOST Best Paper Award, IEEE DAC Best Paper Award, and the Ansys CEO Innovation Award. He worked for Intel and Ansys before his product management role at Synopsys.
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