Multi-Die, Multi-Physics and the Future of Silicon Design Panel

Featured Speakers:

• Sally Ward-Foxton, Senior Reporter. EE Times
• Shankar Krishnamoorthy, Chief Product Development Officer, Synopsys
• Asad Khamisy, Senior Vice President, Engineering, Broadcom
• Aveek Sarkar, Head of Ecosystem and Alliance Management Division, TSMC
• Raja Swaminathan, Corporate Vice President, AMD

Why You Should Watch This Session:

As AI-driven systems push silicon design beyond the limits of traditional scaling, multi-die architectures and multi-physics analysis have become essential to delivering the next generation of performance. Join experts from Synopsys, TSMC, AMD, and Broadcom as they discuss how advanced packaging, 3D integration, thermal and power analysis, AI-driven workflows, and emerging industry standards are transforming the way complex semiconductor systems are designed, validated, and optimized. Discover how the industry is rethinking silicon design to enable faster innovation, greater scalability, and more efficient AI infrastructure.

*This session was part of the Synopsys Converge Executive Forum.