Moderator:
Why You Should Watch:
In this panel discussion, leading experts explore the adoption of multi-die designs, the growing importance of thermal, power, mechanical, and signal integrity analysis, and the need for industry standards to enable the next generation of innovation.
Learn how the semiconductor ecosystem is evolving to address the challenges of designing increasingly heterogeneous systems. Hear industry perspectives on multi-die design trends, multiphysics-driven design workflows, software workload modeling for AI applications, and the technologies shaping the future of silicon design.
*This session was part of the Synopsys Converge Executive Forum.