Faster Closure for Advanced Packages: In-Design HFSS-IC, Optimization, and Agentic AI Workflows

Featured Speaker:

• Amir Asif, Principal Product Engineer, Synopsys

In this webinar, Synopsys shows how 3DIC Compiler and HFSS-IC bring electromagnetic extraction into the design environment. A designer can launch HFSS-IC extraction from an active 3DIC Compiler layout in minutes, enabling earlier SI feedback without leaving the design environment. Design data moves between layout database to HFSS database without GDS export, and layout and project setup are handled by the integration. This allows earlier verification of designs as it matures and opportunity to improve. Post-layout optimization, assisted by reinforced learning, creates design variations and verifies with real HFSS-IC runs. This flow saves time from brute-force trials and ensures no performance is left on the table. Agentic workflows can explore routing parameters against signal-integrity targets, and how prompts can set up an extraction run and return a summary table in minutes.

What You'll Learn:

• Why in-design electromagnetic analysis catches signal-integrity issues before handoff to signoff
• How to launch electromagnetic extraction on a live layout through database-to-database transfer, with no GDS export
• How a pass/fail QoR report lets designers check results against targets 
• Optimize and run many design variations in parallel with SI-driven automatic decision making
• How designers and SI engineers share live designs and exchange feedback without GDS stream-out and stream-in cycles
• How agentic AI sets up extraction runs from prompts and returns summary results in minutes