AI-driven semiconductor demand is pushing manufacturing complexity to new levels—from atomic-scale precision and advanced materials to high-NA EUV, 3DIC, and faster yield ramp. This webinar explores Synopsys’ vision for an atom-to-fab manufacturing continuum that connects atomistic simulation, TCAD, lithography, analytics, GPU acceleration, and AI automation to help reduce costly wafer-based learning and accelerate time to high-volume manufacturing.
What you’ll learn:
- Why AI, advanced nodes, new materials, and 3DIC are increasing semiconductor manufacturing complexity
- How atomistic simulation, TCAD, lithography, and analytics can support a more connected atom-to-fab workflow
- Ways GPU acceleration with NVIDIA is helping improve performance for lithography, TCAD, and atomistic simulation workloads
- How digital twins and AI automation can reduce reliance on costly wafer-based learning
- Real-world examples of design-technology co-optimization for faster process and product ramp