Contact Sales
ansys.com
Synopsys and Ansys power the future of innovation—connecting silicon to systems.
EDA
System
IP
SolvNetPlus
Training & Education
Silicon Realization TechSummit 2022
The Move to Multi-Die - Synopsys Presentation
New Dimensions, New Opportunities: Sparking a New Age of Innovation with Multi-Die Design
Multi-die architectures are emerging as a catalyst, sparking continued innovation and opening up new opportunities in broad market applications, including AI, high-performance computing, and mobile. This presentation will discuss the “coming of age” of multi-die design and highlight Synopsys’ software-to-silicon system-level solution that is enabling the next wave of transformative products.
Shekhar Kapoor, Sr. Director, Product Marketing, Synopsys
Ask
i
NOTICE: You are interacting with an AI-powered chatbot that provides general information about Synopsys, including its products and services, which may be incorrect or incomplete. In the event of any conflict or discrepancy, the terms of your applicable agreements supersede any information provided by this chatbot. These chats may be accessed by Synopsys and its service providers to customize the experience and improve this tool, and your use of this chatbot is an agreement to that data processing activity.