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Training & Education
USB 3.2: A USB Type-C Challenge for SoC Designers White Paper
USB 3.2 extends link architecture using multi-lane operation over USB Type‑C. Lane striping and bonding enable scalable bandwidth across the physical interface. This white paper defines the architecture for multi-lane USB systems.
What You Will Learn:
- Implement Gen Xx2 dual-lane operation using lane striping and bonding
- Distribute payload across parallel TX/RX differential pairs
- Combine lanes to deliver up to 20 Gbps link bandwidth
- Manage lane synchronization and skew alignment
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