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Multiphysics Fusion Technology for Multi-Die Designs Explained

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Synopsys UCIe PHY IP Datasheet

Designing for next-gen AI, data center multi-die packages? Download the Synopsys UCIe PHY IP datasheet and discover a high-bandwidth, low-latency solution—engineered for advanced packaging, robust signal integrity, and seamless interoperability with the latest UCIe specification.

What You Will Learn:

How to achieve up to 64Gbps per pin and 21Tbps/mm bandwidth density
The benefits of integrated signal integrity monitors, built-in test/repair, and hardware-based initialization
How to support on-chip interconnect fabrics including AXI, CHI C2C, CXS, PCIe, CXL, and streaming

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