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Overcoming the Challenges of Verifying Multi-Die Designs
Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die realization.
This white paper focuses on the verification challenges of multi-die designs, including:
- Addressing capacity and performance for system verification
- Validating assumptions made during architecture design
- Knowing when verification is complete
Find out how to overcome such challenges with Synopsys verification solutions. The solutions provide the industry’s best way to verify functionality, CDC and RDC correctness, power intent, and inter-die connectivity. Verification teams can make the transition to multi-die without worrying that this will make their job impossible, consume excessive compute resources, or prolong time to market.
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