Physical Verification of Multi-die Designs with Fanout RDL and Silicon Bridges

As multi‑die integration grows across AI, HPC, automotive, and mobile systems, physical verification becomes harder to scale with traditional interface-based methods. This white paper presents an IC Validator™ inter-die verification approach using an NxM-based flow to verify all interfaces in a single run, improving efficiency and consistency for designs with fanout RDL and silicon bridges.

Download the white paper to learn how to:

• Streamline multi-die physical verification with a unified NxM flow
• Eliminate manual runset creation and reduce complexity
• Improve scalability across heterogeneous 2.5D/3D designs
• Support advanced packaging with fanout RDL and silicon bridge