Effective Monitoring, Test, and Repair of Multi-Die Designs

The shift to multi-die design introduces new challenges in testing, monitoring, and repair across the full silicon lifecycle, requiring more integrated and scalable approaches.
What you’ll learn:

• Key test challenges across die, interconnect, and package levels 
  
• How to enable monitoring, test, and repair across the full silicon lifecycle 
  
• The role of standards and architectures in die-to-die test and diagnosis
  
• How integrated DFx and lifecycle approaches improve yield and reliability