EDA
System
IP
SolvNetPlus
Training & Education
Effective Monitoring, Test, and Repair of Multi-Die Designs
The shift to multi-die design introduces new challenges in testing, monitoring, and repair across the full silicon lifecycle, requiring more integrated and scalable approaches.
What you’ll learn:
- Key test challenges across die, interconnect, and package levels
- How to enable monitoring, test, and repair across the full silicon lifecycle
- The role of standards and architectures in die-to-die test and diagnosis
- How integrated DFx and lifecycle approaches improve yield and reliability
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