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Fanout RDL Routing for Multi-Die Design: Enabling Scalable, High-Performance Die-to-Package Connectivity
Fanout redistribution layer (RDL) interposers provide the routing density and package scalability needed for advanced multi-die designs. However, dense die-to-die connections, high-bandwidth memory (HBM), Universal Chiplet Interconnect Express (UCIe), power delivery, and manufacturing rules create significant implementation challenges. This white paper examines the routing, signal integrity, power integrity, and manufacturability requirements of Fanout RDL designs. Learn how Synopsys 3DIC Compiler brings routing, analysis, optimization, and signoff into a unified design environment.
What You’ll Learn
- Where Fanout RDL fits in advanced packaging
- Why manual routing cannot scale
- How SI and PI affect routing closure
- Which manufacturing constraints must be addressed
- How a unified flow reduces routing iterations
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