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How to Create Efficient Bump and TSV Plans for Multi-Die Designs
In a multi-die design logical and physical interconnectivity between dies (or a die and interposer or other substrate) is achieved through microbumps or hybrid bonding pads between contacting dies. Today’s multi-die designs can have hundreds of thousands or millions of bumps, and this number will be increasing dramatically in the future, as hybrid bonding technology greatly reduces the pitch between connections, allowing for a greater number of inter-die connections.
Read this white paper to
- Find out how to automate bump and TSV planning, visualization, and analysis
- Efficiently manage millions of interconnects while improving productivity
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