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What Designers Need to Know About Advanced Packaging for Multi-Die Designs
Multi-die designs using 2.5D and 3D technologies are increasingly important for a wide range of electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile. Multi-die design enables designers to mix dies from different foundries and technology nodes, including existing dies from previous projects in a single package. The resulting density and interconnect speeds are much greater than those achievable with traditional monolithic dies. Of course, like any advanced technologies, multi-die designs present novel issues that need to be addressed.
This white paper focuses on the advanced packaging requirements, challenges, and key design steps for a successful multi-die design
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