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Training & Education
The Austin Tech Symposium — formerly SNUG Roadshow Austin — is a reimagined event bringing together users, experts, and innovators to connect, network, and exchange ideas shaping the future of chip and system design. While the name is new, the experience remains the same: the high-value, highly collaborative technical content and peer-to-peer exchange you’ve come to expect – now with even more opportunities to engage. Don’t miss this opportunity to learn, share, and help drive the next wave of innovation in our industry.
This year’s event features six dedicated technical tracks—Multi-Die Design, Signoff, Digital Design Implementation, Verification Software, Hardware-Assisted Verification, and Analog/Mixed-Signal Design & Simulation —offering deep, practical insights across today’s most critical design domains, plus Synopsys.ai sessions highlighting how AI is transforming engineering workflows by accelerating implementation and signoff, boosting verification productivity, and enabling smarter system-level decisions through real-world perspectives, actionable takeaways, and expert engagement.
Join your fellow engineers at Austin Tech Symposium to hear practical information you can use on your current projects and the inspiration to create in the Era of Pervasive Intelligence.
Austin Tech Symposium is restricted to Synopsys customers only and offered at no charge.
Why Attend?
- Hear the latest on the Synopsys direction and vision from Raja Tabet, Engineering, Sr. Vice President, Synopsys
- Attend tutorials for the latest advancements in Synopsys technology
- Participate in hands-on Synopsys.ai labs
- Hear users showcase best practices for design & verification challenges
- Technical tracks include: Multi-Die Design, Signoff, Digital Design Implementation, Verification Software, Hardware Assisted Verification, Analog/Mixed-Signal Design & Simulation
- Network with User & Synopsys experts
Keynote Spotlight
Raja Tabet
SVP of Strategic Missions and Technologies, Synopsys
As design complexity continues to grow, engineering teams must adopt new approaches to accelerate innovation and improve productivity. In this keynote, Raja Tabet, SVP of Strategic Missions & Technologies at Synopsys, explores how the industry is re-engineering the future of silicon through advanced co-design and agentic AI. Attendees will learn how Synopsys is bringing together electronic design and multiphysics analysis through Multiphysics Fusion™ technology, while pioneering AI-powered engineering workflows with AgentEngineer™ technology and multi-agent automation. Together, these innovations are helping customers accelerate development, improve performance, and deliver the next generation of intelligent systems.
