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Table of Contents

Keynotes & Live Presentations
News & Resources
Announcement and Product Images
Keynote Images
Executive Forum Images
SNUG and Simulation World Images

Keynotes & Live Presentations

Day 1 Keynote: Re-Engineering the Future

Sassine Ghazi, President and CEO at Synopsys

Featuring special guest Jensen Huang, Founder & CEO at NVIDIA and a dynamic, pre-recorded discussion with Satya Nadella, Chairman and CEO at Microsoft

March 11, 2026

Watch on Demand

Lunch Session: Systems-to-Silicon: The Opportunity for New Engineering Paradigms

Ravi Subramanian, Chief Product Management Officer at Synopsys

March 11, 2026

Watch on Demand

Day 2 Industry Keynote

Chris Miller, Professor, The Fletcher School, Tufts University and author of "Chip War: The Fight for the World’s Most Critical Technology"

March 12, 2026

Watch on Demand

Lunch Session: Delivering Energy Efficiency Breakthroughs for AI Computing

Shankar Krishnamoorthy, Chief Product Development Officer at Synopsys

March 12, 2026

Watch on Demand

News & Resources

Mar 11, 2026

News

Synopsys Outlines Vision for Engineering the Future

Multiphysics Fusion technology is first wave of integrated Synopsys + Ansys capabilities for chip design that combine Synopsys’ flagship silicon design platforms with Ansys’ signoff grade analysis engines

Mar 11, 2026

Blog

New Synopsys Multiphysics Fusion™ Technology Set to Transform Chip and Product Engineering

By Marc Swinnen

Mar 11, 2026

News

Synopsys Launches Ansys 2026 R1 to Re-Engineer Engineering with Joint Solutions and AI-Powered Products

Mar 11, 2026

News

Synopsys Introduces Software-Defined Hardware-Assisted Verification to Enable AI Proliferation

Mar 11, 2026

Blog

Introducing Software-Defined Hardware-Assisted Verification: A New Benchmark for AI-Era Chip Design

By Frank Schirrmeister and Tom De Schutter

Mar 11, 2026

News

Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development

Synopsys Electronics Digital Twin (eDT) Platform Accelerates SDV Development

Mar 11, 2026

Blog

Unveiling the Synopsys Electronics Digital Twin (eDT) Platform

By Marc Serughetti

Jan 20, 2026

Blog

By Rob van Blommestein

Jan 20, 2026

News

Synopsys Announces New Converge Conference, March 11-12, to Drive Intelligent Systems Innovation

Announcement and Product Images

1/6

The Synopsys eDT Platform enables OEMs to achieve up to 90% of software validation prior to hardware availability.

Synopsys announced new software-defined hardware-assisted verification (HAV) platforms and capabilities.

Diagram illustrating clock integrity and clock jitter issues in chip design

Ansys GeomAI platform enables engineering teams to rapidly generate, evaluate, and refine geometry concepts with greater creativity and efficiency

Mesh Agent, an agentic AI feature in Ansys Mechanical™ software, provides guidance to a user working on a PCB simulation

Multiphysics Fusion technology is first wave of integrated Synopsys + Ansys capabilities for chip design that combine Synopsys’ flagship silicon design platforms with Ansys’ signoff grade analysis engines 

Synopsys AgentEngineer™ powers the industry's first L4 agentic workflow

The Synopsys eDT Platform enables OEMs to achieve up to 90% of software validation prior to hardware availability.

Synopsys announced new software-defined hardware-assisted verification (HAV) platforms and capabilities.

Ansys GeomAI platform enables engineering teams to rapidly generate, evaluate, and refine geometry concepts with greater creativity and efficiency

Mesh Agent, an agentic AI feature in Ansys Mechanical™ software, provides guidance to a user working on a PCB simulation

Synopsys AgentEngineer™ powers the industry's first L4 agentic workflow

Images available for download

Keynote Images