A SolvNetPlus account is required to view and download all proceedings content. If you do not have a SolvNetPlus account and are a current customer register here.
Theme: Re-Engineering The Future
| Topic | ||||
| [Keynote 1] Re-engineering the Future of Silicon Design Shankar Krishnamoorthy / Chief Product Development Officer of Synopsys | ||||
| [Keynote 2] The Future of Agentic AI and Innovations in the HBM–HBF–HBS Memory Hierarchy Prof. Jungho Kim of KAIST | ||||
| [Keynote 3] Paving the way for Silicon Intelligence Ben(Hyo Gyuem) Rhew, Corporate VP, Samsung Foundry | ||||
| [Keynote 4] Building a New Memory and Storage Hierarchy for AI Inference SangKyoo Jeong, SVP, SK hynix | ||||
| [Keynote 5] From LLMs to Agentic and Physical AI: Where AI Models Are Headed and What They Demand from Silicon Prof. Jinwoo Shin, KAIST | ||||
| AI-Powered Design Optimization | Multi-Die and Next-Generation Memory | AI-Driven Silicon Innovation | Scalable Verification for AI Chip Era | Shift-Left Manufacturing Design |
| Systematic Exploration of Design Variations using Parametric Scenario Extension (PSX) | Multi-Die Prototyping, Bump Planning, and SI Analysis (with Demo) | Using Synopsys.ai Copilot in Fusion Compiler Platform | Maximizing the benefits from Software-defined Hardware-assisted Verification | TCAD Trend and Update |
| Jaewon Jung , Synopsys | Misun Lim, Synopsys | Sooyeon Kim, Synopsys | Kangwook Lee, Synopsys | Kartik Venkataraman, Synopsys |
| Achieving Signoff Confidence with IR-Aware STA | The X-section optimization of 2.5D signal routing with 3DSO | Agentic AI & Analog, AI driven Analog | Pre-Silicon Real Workloads Validation : Integration of Wireless Network Testers on ZeBu | Overcoming DUV Patterning Challenges with ArF Immersion Extensions |
| Dooha Kim, Samsung | Hyemin Kim, Samsung | Yuval Shay, Synopsys | Kyuho Shim, WooYoung Noh, Samsung | Bongkeun Kim, Samsung |
| AI-Driven Floorplan Exploration for Chip-Size Reduction with DSO.ai | Scaling Timing Signoff for Advanced Node and Multi-Die Designs: Signoff Tutorial - PrimeClock | Analog Layout Synthesis: A new Paradigm to Accelerate Analog Design | Reinforcement Learning–Based Optimization of SoC Performance Parameters on the ZeBu | From Silicon to Systems: Synopsys and NVIDIA Accelerated Engineering |
| Jonghyeop Kim, Samsung | Chul Rim, Synopsys | Donghee Kim, Synopsys | Hyungtae Park, Samsung | Kihang Youn, NVIDIA |
| Improving ATPG Debug Productivity Through Hold-Time Diagnosis | Analysis of PDN in 12-High HBM 3DIC for Heterogeneous Integration | Chiplets for AI Data Centers: Shift-Left, 3DIC Integration, and Co-Packaged Optics | ZeBu - SpeedAdaptor3 solution for CXL 3.x memory | TCAD application use-case |
| Doyeon Hwang, Samsung | Jiwoo Hong, Samsung | Ravi Todi, Synopsys | Minsu Yu, Samsung | Namki Cho, Synopsys |
| Physics-Aware CNN-Based IR Drop Risk Prediction for Fast and Reliable SRAM Placement Optimization | Thermal Analysis Workflow Introduction from On-Chip to PKG | Solving the Al Compute-to-l/O Gap with Scalable Interface IP | VC Z01X - Manufacturing Fault Simulation | Invited talk : Physics-Informed Graph Neural Surrogate for TCAD |
| Seihyung Jang, SK hynix | Steven Choi, SangJae Park, ADTechnology | Manmeet Walia, Synopsys | SeongWook Lee, Samsung | Yoon Kim, Synopsys with SK hynix |
| Low Power Optimization through Fast and Accurate Time-Based Power Analysis | ML-Based Sigma Av–aware Switch Cell Optimization | Addressing Physical AI Application Challenges with Standards-Based IP | Technology Overview: Advancing Analog, Mixed-signal, and RF Designs | Computational Lithography Trends in the AI Era |
| Sora Park , Samsung | Sungsu Byun, Samsung | Mehak Kalra, Synopsys | Yuval Shay, Synopsys | Al Blais, Synopsys |
| Product test pattern count reduction from ATPG configuration optimization with TSO.ai | Accelerating Signoff TAT with HyperScale/HyperGrid and PrimeClosure | Advanced PVT Monitoring Solutions for N2P GAA Technology and AI Workloads | Shift-Left Digital Twin with Virtual Prototyping | Invited talk : Interface physics and contact engineering for 2D FETs using QuantumATK |
| Jaeseok Park, Samsung | Deok-keun Oh, Samsung | Sehee Han, Synopsys | Ingwang Chang, Synopsys | Prof. Changwook Jeong, UNIST |
[Presentation material availability is subject to presenter approval.]