The Synopsys SuperSpeed USB 3.0 PHY IP for the 28FD‑SOI process datasheet describes a low‑power, silicon‑proven physical‑layer solution that enables high‑throughput USB connectivity in advanced mobile and consumer SoC designs. Supporting SuperSpeed USB operation at 5 Gbps and backward compatibility with USB 2.0 data rates when paired with a companion USB 2.0 PHY, this compact mixed‑signal PHY delivers small die area, reduced power consumption, and robust signal performance for device, host, and dual‑role USB applications implemented on 28FD‑SOI technology.
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