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From this Author
Veshal Sridhar
Veshal Sridhar is a Product Engineering Architect at Synopsys, He leads 3DIC solution development with an emphasis on system-level signoff analysis. With more than 10 years of EDA experience, Veshal collaborates with customers and R&D teams to solve complex multi-die design challenges across the entire 3DIC stack, from chip-level analysis to full-system signoff involving dies, interposers, and advanced packages.
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