PrimeTime Static Timing Analysis

The PrimeTime® Suite, enabled with Synopsys Multiphysics Fusion™ capabilities, delivers fast, memory-efficient scalar, distributed, and multicore computing, along with distributed multi-scenario analysis for advanced SoC and multi-die designs. As the industry's trusted golden signoff solution, PrimeTime provides comprehensive timing, signal integrity, power, and variation-aware analysis while incorporating real-world physics effects directly into timing signoff. By bringing IR-aware, thermal-aware, and stress-aware analysis into the signoff flow, PrimeTime enables engineers to evaluate timing under realistic operating conditions, improve correlation between in-design analysis and final signoff, and achieve more robust timing closure.

The solution combines PrimeSim™ HSPICE®-accurate analysis with multiphysics insights to accurately model delay impacts caused by voltage drop (IR drop), temperature variation, and thermo-mechanical stress. This enables engineering teams to identify and resolve issues earlier in the design process, reduce overly conservative timing margins without sacrificing reliability, and lower tapeout risk while ensuring design integrity. The result is improved predictability, optimized silicon performance, and reduced design iterations.

By unifying trusted EDA signoff with high-fidelity multiphysics analysis, PrimeTime helps teams accelerate design convergence and improve productivity through faster turnaround times for both large and small designs. Its scalable architecture and hierarchical methodology support distributed analysis for multi-billion-instance chips, enabling signoff closure for the most demanding AI, HPC, and advanced semiconductor designs while increasing confidence in first-pass silicon success.