In an effort to simplify photonic integrated circuit (PIC) input/output (I/O) and packaging, Chiral Photonics, in collaboration with Synopsys, is pleased to announce design support within OptoDesigner for Chiral Photonics' optical couplers and packaging services
Chiral Photonics (USA), offers its pitch reducing optical fiber arrays, PROFAs, which enable the highest density optical I/Os for both edge and face coupling to photonic ICs. Chiral Photonics also offers packaging services for implementing these ultra-dense optical I/Os within both development and production packages.
With this Packaging Template, photonic IC designers can use Chiral Photonics packaging templates within the latest release of OptoDesigner. These templates are available for adding optical fiber coupling to InP chips from FhG/HHI and SMART Photonics and to silicon photonics chips from imec and CEA-Leti.
Read more about the products and services of Chiral Photonics: www.chiralphotonics.com.