The use of CMOS fabrication technology has enabled large scale integration of photonic components at chip level – called Photonic Integrated Circuits (PICs). The concepts of fabless manufacturing and multi-project-wafer (MPW) services are now widely available for PICs, for various base materials. Low-cost access to generic fabrication processes for rapid prototyping and low volume production has shifted the emphasis to design innovation.
This course intends to introduce basics of PIC technology and provide introductory hands-on training on PIC designing. The training is structured in two parts:
The training is divided into two parts: seminars (1 day) and hands-on sessions (2 days). Participants, depending on their requirements, can attend either part 1 (Technology Overview), part 2 (Design Overview), or both. If you wish to attend both (all three days) please ensure you book both part 1 and part 2
Day 1: PIC Technology Overview seminars (Part 1)